Silicone Potting and Encapsulating Adhesives for Electronics

Incure Silicone Potting and Encapsulating Adhesive is the ideal choice for protecting sensitive electronic components from extreme environments. These potting materials and encapsulants can withstand temperatures from -45°C to 250°C while protecting the components from vibration, moisture, and atmospheric contaminents. Consists of both tin and platinum curing systems in a variety of durometers and cure speeds.

• Wide Operating Temperatures
• Flexible
• UV Resistance
• Resistant to Humidity and Water

Overview of Product Spectrum
Product	Chemistry	Color	Work Time	Cure Time	Viscosity	Temp. Resistance	Elongation	Tensile
			RT, min	Tack Free	cP	°C	%	psi
CC-608	Oxime	Clear	10	20 min TF	100	-45 to 250	N.A.	N.A.
CC-621	Oxime	Light Blue	60	24 hrs. RT	3600	-45 to 250	200	350
CC-622	Platinum	Clear	>120	10 min 150°C	1000	-45 to 250	N.A.	N.A.
CC-623	Platinum	Clear	120	10 min 150°C	1000	-45 to 250	N.A.	N.A.
CC-624	Platinum	Clear	120	10 min 150°C	1000	-45 to 250	N.A.	N.A.
CC-625	Bi-Cure	Clear	15 sec. uv	24 hrs. RT	400 – 800	-45 to 250	N.A.	100
CC-626	Platinum	Light Blue	30	60 min RT	1000	-45 to 250	>200	50
CC-627	Platinum	Clear	120	10 min 150°C	1000	-45 to 250	200	50
Package Size: 10.3 oz.cartridge / 40 lb.

www.uv-incure.com

Silicone Potting and Encapsulating Adhesives for Electronics

CC-627

CC-626

CC-625

CC-624

CC-623

CC-622

CC-621

CC-608

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