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UV Adhesives and Equipment

Encapsulants for Microelectronic Assembly
and IC Protection....Need a sample? Fill in your request here

DYMAX Ultra Light-Weld® encapsulants cure in seconds upon exposure to UV and/or visible light to produce tough, flexible encapsulants for bare die, wire bonds, or integrated circuits (IC). The fast cure helps reduce processing and energy costs associated with alternative technologies. The materials are all one part, so no mixing is required and viscosity is consistent. DYMAX encapsulating materials have high ionic purity, resistance to humidity and thermal shock which effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers which may abrade fine wires. Their combination of low Tg and low modulus translates into low stress for bonded wires.

Ultraviolet light curing resins are ideal for glob top and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit or attaching it to glass or PCB. A wide range of viscosities, from thin wicking to non-flowing gel is available. DYMAX LED Protection encapsulants are also available to enhance LED performance. s
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Adhesives Application Viscosities (nominal) Cured
Apperance
Substrates
Package Sizes
Available
MSDS
9001 E-V3 Series
 Chip-on-board; chip-on-flex; multi-chip modules; chip-on-glass; wire bonding; bare die encapsulation
4,500 cP nominal
17,000 cP nominal
50,000 cP nominal
Clear
Ceramic
Leadframe
PCB
Flex
Silicon
 10 mL Syringe (MR)
30 mL Syringe (MR)
170 mL Cartridge
300 mL Cartridge
1 Liter Wide-Mouth Bottle (Ver3.5/Ver3.7)
1 Liter Cylinder Bottle (Ver3.1)

 9001 E-V3 Series
9008
 Chip-on-flex encapsulation and flex circuit bonding/attachment
4,500 cP
Clear
Ceramic
Leadframe
PCB
Flex
Silicon
10 mL Syringe (MR)
30 mL Syringe (MR)
170 mL Cartridge

Halogen-Free Background
Bromine and chlorine are known to emit toxic and corrosive gases when ignited. In 2003, standards created by the International Electromechanical Commission (IEC) were passed into law to eliminate concerns associated with end of life/disposal of devices containing these chemicals. Initial target areas include consumer electronics and household appliances.
 


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