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Encapsulants
for Microelectronic Assembly
and IC Protection....Need
a sample? Fill in your request here
DYMAX
Ultra Light-Weld® encapsulants cure in seconds upon exposure to
UV and/or visible light to produce tough, flexible encapsulants for
bare die, wire bonds, or integrated circuits (IC). The fast cure helps
reduce processing and energy costs associated with alternative
technologies. The materials are all one part, so no mixing is required
and viscosity is consistent. DYMAX encapsulating materials have high
ionic purity, resistance to humidity and thermal shock which
effectively protect components. These encapsulants contain no sharp,
abrasive mineral or glass fillers which may abrade fine wires. Their
combination of low Tg and low modulus translates into low stress for
bonded wires.
Ultraviolet
light curing resins are ideal for glob top and chip-on-board
applications. They may also be used on flex circuits (FPC) for
encapsulating ICs, coating the circuit or attaching it to glass or PCB.
A wide range of viscosities, from thin wicking to non-flowing gel is
available. DYMAX LED Protection encapsulants are also available to
enhance LED performance.
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| Adhesives |
Application |
Viscosities
(nominal) |
Cured
Apperance |
Substrates
|
Package
Sizes
Available
|
MSDS
|
|
9001
E-V3 Series
 |
Chip-on-board; chip-on-flex; multi-chip
modules; chip-on-glass; wire bonding; bare die encapsulation |
4,500
cP
17,000 cP
50,000 cP
|
Clear
|
Ceramic
Leadframe
PCB
Flex
Silicon
|
10 mL
Syringe
(MR)
30 mL Syringe (MR)
170 mL Cartridge
300 mL Cartridge
1 Liter Wide-Mouth Bottle (Ver3.5/Ver3.7)
1 Liter Cylinder Bottle (Ver3.1)
|
9001
E-V3 Series |
9008
 |
Chip-on-flex encapsulation and flex
circuit bonding/attachment |
4,500
cP
|
Clear
|
Ceramic
Leadframe
PCB
Flex
Silicon
|
10 mL
Syringe
(MR)
30 mL Syringe (MR)
170 mL Cartridge |
|
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Halogen-Free
Background
Bromine and chlorine are known to emit toxic and corrosive gases when
ignited. In 2003, standards created by the International
Electromechanical Commission (IEC) were passed into law to eliminate
concerns associated with end of life/disposal of devices containing
these chemicals. Initial target areas include consumer electronics and
household appliances.
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g
machine, laser soldering robot
Help us to understand you more:
1. What are you using now?
(CA / Urethane /
Epoxy / Acrylic UV / Activator Cure Acryl / Hot Melt / Silicone etc.)
2. What are the reasons for the change or is this a new
project.
3. What is the end product? (Appliance,
Notebook, Mobile Phone
etc.)
4. What is the substrate / material? (ABS,
PVC etc.)
5.
What is the board size and coat thickness required?
6. Are there any shadowed areas?
7. What chemical is used and duration of the process?
8. What is the expected monthly production volume?
9. How do you plan to dispense and cure the proposed
material? (Manual or
Automation)
What are the requirements for the following:
1. Viscosity (cps)
2. Hardness / Flexibility
3. Colour, Clarity or Fluorescing needed
4. Military Specification
5. UL Recognized
6. Thermal Limit
7. Low Outgassing
8. Moisture Resistance
9. Surface / Volume Resistivity
10. Curing Method (UV / Heat or
Moisture)
11. Others
(please specify)
What
are the testings done:
1.
Adhesion
2. Thermal Shock /
Cycle
3. Electrical Properties
4. Moisture / Humidity /
Solvent Resistance
5. Others (please specify)
Email
Us!
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SINGAPORE
33 Ubi Ave 3, #04-23 VERTEX
Singapore 408868
Tel 65 6270 2188
Fax 65 6270 9188 |
MALAYSIA
PT1866 Tingkat Perusahaan 6
Prai Free Industrial Zone, 13600 Prai
Penang, Malaysia
Tel 604 390 5882
Fax 604 390 0082 |
THAILAND
8 Soi Lasalle 77, Kwaeng Bangna, Khet Bangna
Bangkok 10260, Thailand
Tel 66 2361 2926, 66 2361 2927
Fax 66 2361 2928 |
HONG KONG
33 Ubi Ave 3, #04-23 VERTEX
Singapore 408868
Tel 852 8199 0955
Fax 65 6270 9188 |
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©2012 Blaze Technology Pte
Ltd, Specifications subject to change without notice.
Email: sales@blazeasia.com | Website: www.blazeasia.com
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