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UV Adhesives and Equipmen
UV Adhesives and Equipmen t
 

Thermal Interface Materials....Need a sample? Fill in your request here.......

DYMAX Multi-Cure® thermal interface materials may be cured with light, heat, or activator. Most applications utilize a combination of these methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing parts in place so activator or heat can continue curing in shadowed areas without interruption to process flow.

Dymax thermal interface materials offer thermal conductivity levels as high as 1.2 W/m*K. They are high viscosity and highly thixotropic for optimal dispensing and material placement.


Flip the UV Curable Adhesives, Conformal Coatings, and Encapsulants Selector Guide
Adhesives
Features
Viscosity
(nominal)
Uncured
Appearance
Substrates
Packages Sizes
Available
MSDS
9-20801 Thermally conductive; 1.2 W/m*K; UV/Visible light cure for exposed areas in seconds; activator or heat cure shadowed areas; one part; solvent free
110,000 cP
Off White
PCB
Ceramic
Metal
10 mL Syringe (MR)
30 mL Syringe (MR)
170 mL Cartridge
9-20801
Adhesives
Features
Viscosity
(nominal)
Flash Point
(Closed Cup)
Specific Gravity
Packages Sizes
Available
MSDS
501-E Solvent-free activator; Low viscosity ideal for thin spray or brush applications
30-40 cP
245°F
1.0 8.3 mL Vial
8 Ounce Can
One Quart Can
One Gallon Can
5 Gallon Can
2009

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