LIGHT-CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY

Overview of Product Spectrum (Metal Bonder)

Cures with UV / Visible /  Heat or Actif 398. Good clarity, heat and moisture resistance. Good passive vibration isolation capability. Ideal for relays for circuit breakers in the electronics industry for outdoor use.

Clear

Cures tack-free with up to 5,400 PSI on many different metals / glass /  ceramics. Very low linear shrinkage with enhanced excellent moisture and temperature resistance. Good passive vibration isolation capability.

Clear

Overview of Product Spectrum (Plastic Bonder)

Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

Medium viscosity, acid-free, multi-substrate /  plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

Slightly Translucent 

Medium viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

Clear

Overview of Product Spectrum (Potting)

Very thick, low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties.

Slight Translucent

Cost efficient epoxy-acrylate, thick viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. UV / Heat curable. Chemical and vapor resistance.

Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting material for use in sensitive electronic devices. Chemical and vapor resistance.