| Chip-on-Board (COB) Encapsulants and Wire Bonders |
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| Overview of Product Spectrum | |||||||
| Product | Description |
Color | Viscosity | Shore | Elongation | ||
| cps | Hardness | % | |||||
| EL-9047 | Flexible, High Adhesion, High Moisture Resistance, Bonds to Wide Variety Substrates |
Clear | 4,000 - 5,000 | A85 | 300 | ||
| EL-9050 |
Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas |
Clear | 4,000 - 5,000 | D45 | 150 | ||
| EL-9054 |
Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas |
Clear |
15,000 - 17,000 | D45 | 150 | ||
| EL-9062 |
Moisture and Thermal Resistant, Secondary Heat Cure for Shadowed Areas, Flexible |
Clear | 15,000 - 17,000 | D40 | 35 | ||