Loading color scheme

  Chip-on-Board (COB) Encapsulants and Wire Bonders
    Overview of Product Spectrum
    Product Description
 Color Viscosity Shore Elongation
          cps Hardness %
    EL-9047 Flexible,ASDadASD High Adhesion, High Moisture Resistance, Bonds to Wide Variety Substrates
 Clear 4,000 - 5,000 A85 300
    EL-9050

Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas

 Clear 4,000 - 5,000 D45 150
    EL-9054

Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas

 Clear
 15,000 - 17,000 D45 150
    EL-9062

Moisture and Thermal Resistant, Secondary Heat Cure for Shadowed Areas, Flexible

 Clear 15,000 - 17,000 D40 35