UV Light Curable Encapsulants for Microelectronic Assembly and IC Protection
NEW! Hybrid CoatTM EL-9088
A Truely UV Curable Black Encapsulant
EL-9088 UV Black, Micro-Electronics Encapsulant is a hybrid opaque UV/heat curable adhesive that bonds to various substrates. Designed for use for as a dam and fill material, this product can be effectively cured in less than 3 minutes up to a thickness of 1.25mm. EL-9088 is also commonly used as a potting material of more than 2.5mm in depth and can be effectively cured in 30 mins at 110°C. Formulated to withstand thermal cycles of -40°C to 150°C with improved moisture and thermal resistance.
Hybrid CoatTM Series of UV Encapsulants offers manufacturers many benefits including faster production speed and capacity, less floor space (eg. special storage conditions), reduction of Work-In-Process, increasing yields and reducing scrap to name a few.
Advantages of Incure's EL-9088
• One Component - No Mixing
• Solvent Free
• Low Odor
• Ease of application, "Ready-To-Use" Product
• Room Temperature Storage
• Shelf Life (6 months)