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Incure Thermally Conductive Adhesives are suitable for bonding copper heat exchange tube to steel cores, aluminium heat sink to power semiconductor devices. These thermal conductive epoxy adhesives exhibit excellent mechanical strength, low shrink rate and thermal properties. Incure thermal materials provide solutions to a variety of electrical, electronic and thermal design problems throughout industry.

    Overview of Product Spectrum
    Product Description   Ratio Color Viscosity (Mixed) Volume Resistivity Dielectric Strength Thermal Conductivity Temp. Resistance
              cP ohms-cm volts/mil Btu-in/hr-ft2-°F °C


Thermally Conductive, Aluminum-Filled, Two Part Epoxy Paste   100:12 Grey 10,000 1.0 x 105 50 12.5 300
Thermally Conductive, AluminumNitride Filled, 1:1 Epoxy Paste   1:1 Grey 35,000 1.0 x 1015 250 8.5 204
    TC-9033 Thermally Conductive, Aluminum-Filled, 1:1 Epoxy Paste   1:1 Grey Paste 1.0 x 105 80 9.0 204
    Package Size: Pint 473.18 ml / Quart 946.35 ml / Gallon 3.79 ltr