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Silicone Potting and Encapsulating Adhesives for Electronics

Incure Silicone Potting and Encapsulating Adhesive is the ideal choice for protecting sensitive electronic components from extreme environments. These potting materials and encapsulants can withstand temperatures from -45°C to 250°C while protecting the components from vibration, moisture, and atmospheric contaminents. Consists of both tin and platinum curing systems in a variety of durometers and cure speeds.

• Wide Operating Temperatures
• Flexible
• UV Resistance
• Resistant to Humidity and Water

    Overview of Product Spectrum
    Product Chemistry Color Work Time Cure Time Viscosity Temp. Resistance Elongation Tensile
          RT, min Tack Free cps °C % psi
    CC-608 Oxime Clear 10 20 min TF 100 -45 to 250 N.A. N.A.
    CC-621 Oxime Light Blue 60 24 hrs. RT 3600 -45 to 250 200 350
    CC-622 Platinum Clear >120 10 min 150°C 1000 -45 to 250 N.A. N.A.
    CC-623 Platinum Clear 120 10 min 150°C 1000 -45 to 250 N.A. N.A.
    CC-624 Platinum Clear 120 10 min 150°C 1000 -45 to 250 N.A. N.A.
    CC-625 Bi-Cure Clear 15 sec. uv 24 hrs. RT 400 – 800 -45 to 250 N.A. 100
    CC-626 Platinum Light Blue 30 60 min RT 1000 -45 to 250 >200 50
    CC-627 Platinum Clear 120 10 min 150°C 1000 -45 to 250 200 50
    Package Size: 10.3 oz.cartridge / 40 lb.            
                 
    www.uv-incure.com